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Cooling system to combat high heat generation in CPUs/GPUs and improve energy efficiency of data centers
Sanoh Industrial Co., Ltd.
Liquid cooling system
Thermal solutions

Liquid cooling system is an air conditioning method that can address the issue of high heat generation that occurs when high-speed CPU/GPU calculations are performed in AI and other applications, and can improve energy efficiency of data centers.

Sanoh's liquid cooling piping system, which uses technology that eliminates the risk of water leaks and is used in the cooling piping system of Fugaku (HPC), contributes to reducing power consumption in data centers, saving energy, reducing CO2 emissions, and improving the performance of high-performance servers.

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Water-cooled cooling system with high cooling efficiency

Liquid cooling system with high cooling efficiency

Liquid cooling system is the optimal air-conditioning method for dealing with high heat generation in data centers and CPUs/GPUs. They also contribute to energy saving and reducing CO2 emission.

Customization is also available

Customization is also available

We design and manufacture optimal specifications by combining metal processing and resin molding technology with various materials such as iron, stainless steel, aluminum, and resin.

Water-leak-free technology

Water-leak-free technology

Our leak-free technology, backed up by years of experience and track record, was also adopted as liquid cooling piping system for the supercomputer “Fugaku”.

Our products

Server rack liquid cooling device

Installed on the back of the server rack, the discharged heat passes through the pipe structure and is absorbed (heat exchange) by the water circulating inside the pipe.

Main applications

  • Cooling of server racks in data centers

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Server rack water-cooled cooling device
Pipes and manifolds for cooling system

Pipes and manifolds for cooling system

Pipes and manifolds that connect the cooling system of super computer, which are significantly lighter than conventional rubber hoses and stainless steel manifolds.

Main applications

  • Cooling for super computer
  • Can also be used in cooling system that requires high-performances cooling functions for data center and communication equipment.

Resin tubes

Flexible and strong, they can be used to implement systems that take advantage of their light weight.

Main applications

  • Cooling water paths between the main pipes, manifolds, and liquid cooling heat sinks (cooling plates)
  • In addition to resin tubes, we can also provide metal tubes that have excellent pressure resistance and strength.

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Resin tubes
Heat sinks (cooling plates) for water cooling server

Heat sinks (cooling plates) for liquid cooling server

A liquid cooling heat sink (cooling plate) with a thin structure that can be mounted on a 1U server.
This heat exchanger uses a resin upper case, making it light weight and offering excellent design freedom.
In addition, it can be provided as an assembly with resin tubes.

Main applications

  • CPU/GPU coolers for liquid cooling servers
  • This heat exchanger is ideal for areas that require localized cooling, such as liquid cooling for semiconductor manufacturing equipment and communication equipment.

Liquid cooling heat sink (cooling plate)

A liquid cooling heat sink (cooling plate) with a simple structure using aluminum extrusion material.
A liquid cooling heat sink (cooling plate) with a thin structure with a width of 10 to 300 mm, length of 300 to 1,000 mm, and height of 5 mm or more.

Main applications

  • Battery cooling
  • Applicable to a wide range of liquid cooling equipment needs, such as liquid cooling for semiconductor manufacturing equipment and communication equipment.

Customized product information

Water-cooled heat sink (cooling plate)

Case studies

Adopted for cooling piping on Fugaku (HPC)

Our manifolds, tubes, and quick connectors have been adopted by the supercomputer Fugaku (RIKEN) via Fujitsu Ltd.

System implementation technology for the supercomputer “Fugaku”
https://www.fujitsu.com/jp/documents/about/resources/publications/technicalreview/2020-03/article04.pdf

Manifolds
Manifolds
Resin tubes, quick connectors
Resin tubes, quick connectors
Photos of reference equipment installed on Fugaku
Photos of reference equipment installed on Fugaku

Information on customized products

-liquid cooling heat sink (cooling plate) –

water-cooled heat sink

We provide customized products according to customer specifications.

We are also developing a liquid cooling heat sink (cooling plate) that directly cools CPUs/GPUs. We provide reliable piping specifications that have a proven track record in automotive parts, including tubes and connectors.

Basic specifications

We optimize the fin shape and create design according to customer specifications.

We have a track record of developing various fin shapes, and we will design liquid cooling heat sink (cooling plate) that matches the cooling performance and pressure loss desired by the customer.

The balance between cooling performance and pressure loss can be adjusted by the fin shape of the heat exchanger. For example, you can select wave fins or pin fins to improve cooling performance, and straight fins to keep pressure loss low.

water-cooled heat sink (cooling plate)

Liquid cooling heat sink (cooling plate) performance

We are developing fins with high cooling performance. Compared to straight fins, we have a track record of developing high-performance fins even with a lower flow rate of cooling water.
When compared with the same pressure loss, the thermal resistance is reduced by 26%.

Water-cooled heat sink (cooling plate) performance

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